Hylax Technology develops laser equipment for pcb laser depaneling, precision laser marking, semicon laser marking, wafer laser marking, laser trimming on flat panel display, laser welding, pico second UV laser applications and many others. We integrate lasers from many OEMs, design our own optics beam delivery subsystem and package with material handling and vision imaging system into standard equipment for customers. We have many ingenious and sophisticated solutions to assist manufacturers to enhance and improve their process capabilities.