Industrial Laser Equipment Solution Provider

Hylax Technology develops laser equipment for pcb laser depaneling, precision laser marking, semicon laser marking, wafer laser marking, laser trimming on flat panel display, laser welding, pico second UV laser applications and many others. We integrate lasers from many OEMs, design our own optics beam delivery subsystem and package with material handling and vision imaging system into standard equipment for customers. We have many ingenious and sophisticated solutions to assist manufacturers to enhance and improve their process capabilities.

Hylax proprietary scanvision

PCB depaneling closely follow required shape
Laser welding of plastic components

Semicon wafer marking
Seven marking heads on glass

Laser polishing
Laser welding

Copper leadframe matrix drilling
Wire insulation stripping

Stent hole drilling
Laser trim with post verification